1. 2. 3. material content data sheet sales product name tda5212 issued 8. october 2014 ma# MA000223762 package pg-tssop-28-1 weight* 106.98 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 2.457 2.30 2.30 22970 22970 leadframe non noble metal nickel 7440-02-0 14.398 13.46 134585 non noble metal iron 7439-89-6 19.882 18.59 32.05 185856 320441 wire noble metal gold 7440-57-5 0.938 0.88 0.88 8769 8769 encapsulation organic material carbon black 1333-86-4 0.196 0.18 1833 plastics epoxy resin - 8.301 7.76 77599 inorganic material silicondioxide 60676-86-0 56.867 53.16 61.10 531582 611014 leadfinish non noble metal tin 7440-31-5 1.539 1.44 1.44 14391 14391 plating noble metal silver 7440-22-4 1.416 1.32 1.32 13233 13233 glue plastics acrylic resin - 0.196 0.18 1836 noble metal silver 7440-22-4 0.786 0.73 0.91 7346 9182 *deviation < 10% sum in total: 100.00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. this product is in compliance with eu directive 2011/65/eu (rohs) and does not use any exemption. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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